Underfill

Underfill is the filling of the cavities between the terminals of the semiconductor chip and the circuit carrier with a correspondingly elastic and temperature-resistant encapsulation material.
The encapsulation is usually applied on one side, along one edge of the semiconductor chip and infiltrates it by capillary action.

With the PDos dosing system from perfecdos, the capillary effect is enhanced or accelerated by the very fast droplets.
In addition the application speed can be easily varied according to the optimum capillary conditions (geometrieb dependent). In this case, the control of the dosing valve can be taken over by the system control. Additional control units are completely omitted.

The shortest possible process times result from the elimination of the height adjustment of the needle during processing in the panel, as well as the targeted drop break-off (material-dependent after 3-10ms).

 

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